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    Direct Imaging System SDES Series

    OUTLINE

    • Process for all layer including inner, outer and Solder mask.
    • Optimized for small quantities of many varieties.
    • Prompt sample production lead-time
    • Mass production for high density HDI

    FEATURE

    • High precision double-sided exposure technology.
    • High intensity Light source
    • Maximize productivity using Multi Optical Head
    • Real time calibration technology for Scale and line-width

    L/S=10um(DRF:25umt)

    L/S=12um(DRF:25umt)

    L/S=20um(DRF:25umt)

    SPEC

    ITEM SPEC
    Maximum imaging size 650(W)x820(L)mm
    Data format RS274X, GDSⅡ
    Light Source Laser Diode
    Exposure Wavelength 405nm
    Minimum Pattern size 20um L/S
    Data Resolution 1um
    Overlay ≤±10um
    Throughput 20sec (@20mj)
    Auto-Scaling Yes
    Auto-Calibration Yes
    Calibration of partial Yes
    Panel Tracking Yes

    Direct Imaging System Roll to Roll

    OUTLINE

    • Roll to Roll Automatic equipment
    • Sheet Type Manual production
    • Support for smart factory system integration
    • Prompt sample manufacturing lead-time
    • Mass production for High density of HDI

    FEATURE

    • High precision double sided exposure
    • High intensity laser sources
    • Maximize productivity with Multi optical head.
    • Real time calibration of scale and line-width
    • High precision Overlay

    L/S=10um(DRF:25umt)

    L/S=12um(DRF:25umt)

    L/S=20um(DRF:25umt)

    SPEC

    ITEM SPEC
    Maximum imaging size 2000(W)x520(L)mm
    Data format RS274X, GDSⅡ
    Light Source Laser Diode
    Exposure Wavelength 375nm, 405nm
    Minimum Pattern size 20um L/S
    Data Resolution 1um
    Overlay ≤±9um
    Throughput 25sec (@23mj)
    Auto-Scaling Yes
    Auto-Calibration Yes
    Calibration of partial Yes
    Panel Tracking Yes

    Direct Imaging System META Series

    OUTLINE

    • High resolution exposure system for semiconductor package field.
    • Top notched L/S 5um line-width formation
    • LDI Equipment optimized for Semiconductor package/Wafer MEMS 4~12”
    • L/S 2/2um, 5/5um for high density and scaling-down package technology

    FEATURE

    • High resolution scaling-down line width
    • High intensity laser (375,405nm)
    • Maximize productivity using Multi Optical Head
    • High precision Overlay

    Independent exposure head configuration

    High speed exposure

    SPEC

    ITEM SPEC
    Maximum imaging size 650(W) x 900(L) mm, 2100(W) x 620 (L)mm
    Data format RS274X, GDS, ODB++
    Light Source Laser Diode
    Exposure Wavelength 375nm, 405nm
    Minimum Pattern size 2um L/S 5um L/S
    Data Resolution 0.1um 0.25um
    Overlay ≤±1um
    Throughput 39sec (@20mj)
    Auto-Scaling Yes
    Auto-Calibration Yes
    Calibration of partial Yes
    Panel Tracking Yes

    Direct Imaging System SDES-LDI2000 Series

    OUTLINE

    • High efficiency, High productivity L/S 10um/20um exposure engine
    • 2 wave length light source (365nm, 405nm)
    • Applicable to High aspect ratio substrate(Basic 600x2,000)
    • Capable of arrangement at one time (Maximum 600x2,000 1EA or 300x2,000 2EA)
    • Capable of Batch exposures through multi Substrate arrangement
    • Capable of Multi layout alignment Scale calibration
    • Divided-Calibration inside of substrate is possible
    • By split exposure, Maximum 4m substrate divided exposure is possible

    FEATURE

    • High efficiency, High productivity exposure head
    • High intensity light source (375nm, 405nm)
    • Maximize productivity using Multi Optical Head
    • Batch exposures through Multi Substrate arrangement
    • Implementation of Divide Exposure Function

    SPEC

    ITEM SPEC
    Maximum panel size 650(W)x2,050(L)mm 0.2~2mm thickness
    Maximum imaging size 600(W)x2,000(L)mm
    Data format Gerber data(RS274X) ODB++ (Option)
    Light Source Laser Diode Module (5W, 12W, 30W)
    Exposure Wavelength 405nm : 5W, 10W, 30W 375nm : 10W *Total : 40W
    Minimum Pattern size 20um L/S
    Data Resolution 1um
    Overlay ≤±9um
    Tact time < 120sec (@200mj, 175mmx2,000mm)
    Auto-Scaling Yes
    Split Calibration Yes
    Divided align Yes
    Panel Tracking Yes

    Lithography System SDLM-Optics

    OUTLINE

    • Optical system for manufacturing DI(direct Imaging) Exposure equipment and data transmission module

    FEATURES

    • L/S(Line & Space) : 5, 10, 20um
    • Light source : Laser diode 375, 405 wave length. (Singular wave length is possible)
    • PCB, Wafer, Package Substrate, MEMS and Mask Writer, etc.
    • Can be applicable to exposure fields.
    • Development platform in Windows settings provided.
    • Trigger-Based Synchronization functionality provided

    High-Performance Modules for Direct Imaging

    OUTLINE

    • Application in the manufacturing of DMD (TI, USA) based equipment
      such as DI (Direct Imaging) machines, 3D scanners, and 3D printers.
    • Development platform
      · OS : Windows 10 or higher version
      · Tool : C#, Visual C++
      · Format : SDK

    SPEC

    ITEM SPEC
    Chipset DLP9500 & DLPC410
    DLP Format 0.95” 1080p
    Window Options VIS, UV
    Micromirrors 1920 x 1080
    Data Format Gerber(RS274x)
    Speed ~22,000fps(Frame Per Second)
    Data Resolution 0.05~2um
    PC Interface 10G Ethernet