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    Laser Micro Hole Drilling SDL-FI200

    OUTLINE

    • Vertical Probe card guide plate hole processing
    • Hole processing according to Flexible probe pin shape
    • Various types of material
      (Ceramic, Polymers, Metal, Glass, etc.)

    FEATURES

    • High precision universal laser system (IR Pulsed Laser)
    • High precision Scan System (Scan System Auto Calibration S/W)
    • X,Y,Z,T Linear Motion System (2D Motion Auto Calibration S/W)
    • Integrated Auto inspection Vision System
    • Maximum hole processing size : 200mm × 200mm
    • On The Fly Option

    SPEC

    Si3N4 (Silicon Nitride) 0.125 T 0.25 T
    Min. Hole Size 30 × 30um 30 × 30um
    Min. Hole Pitch > 40um > 50um
    Hole Taper < 5um < 10um
    Corner Radius of Rectangular Hole < R 4um < R 6um
    Hole Size Repeatability ± 1.5um ± 1.5um
    Hole Position Error ± 1.5um ± 1.5um

    Micro Rectangular Holes on Guide Plates

    Low Leakage Tester

    OUTLINE

    • Probe card reliability verification equipment for DC parameter testing process
    • To determine the interference between the channels of the probe card, measure the leakage current for each channel

    SPEC

    ITEM SPEC
    Measuring Instruments Keithley 6430
    Communication RS232
    Number of Channel 48CH. (Max : ~128CH)
    Channel Board 8CH. Per 1board
    Measurement Range 10aA ~ 105mA
    Source Voltage 0V~20V
    Operating Environment Temperature : 20℃(±1℃)
    Humidity : 30%~50%

    Relay Switching Board for Probe Card Tester

    OUTLINE

    • Probe Card Electrical Characterization Testing Equipment
    • Replacement of mechanical relay channel control with electronic switch (MAX313L, Analog Switch)
    • Guaranteed relay permanent lifespan, equipment miniaturization, and improved measurement speed

    SPEC

    ITEM SPEC
    Measuring Instruments Keithley 6487 Source Meter
    Agilent 4263B LCR Meter
    Communication RS485
    Number of Channel ~ 5400CH
    Channel Board 100CH. per 1board
    Source Voltage 0V~20V
    Operating Environment Temperature : 20℃(±1℃)
    Humidity : 30%~50%

    Probe Card Tester SDP3000

    OUTLINE

    • Probe Card Electrical Characterization Testing Equipment
    • Capability to verify the X & Y positions and diameter of probe card tips
    • Ability to test open and contact resistance of probe card tips

    SPEC

    Item SPEC
    Probe stage x, y working area 200X200mm
    z axis working area: 12mm
    z axis force >100kg
    x, y, z precision ±1um
    repeatability ±1um
    Vision F.O.V X=0.86mm(SCAN)
    working Distance 20mm±2mm
    CCD ½”
    resolution 1600X1200 pixel
    Leakage Test 1pA~2mA

    PRVX Mother Board

    OUTLINE

    • Motherboard used with probe card analysis equipment
    • Components required for probe card correlation and performance measurement before production wafer testing

    SPEC

    Layer SPEC
    Test Device BGA, WLCSP, LED, ETC
    Test Pitch (mm) 0.35 / 0.4 / 0.5 / 0.65 / 0.75 / 0.8 / 1.0
    Temp -50℃ ~ 200℃
    Life Cycles > 300,000 Cycles
    Test Pin POGO Pin, J contactor

    Probe Card Manual Tester SDP-200C

    OUTLINE

    • Manual inspection equipment for checking the connection between the probe pin and main PCB during the probe card manufacturing process
    • Process equipment used to check the connection status of probe pins after probe card assembly or before shipment

    SPEC

    ITEM Contents
    PC Specification - CPU: Pentium
    - OS: Windows 7 or higher
    - Monitor: 17” or larger
    - RAM: 2GB or more
    - Communication: RS232
    Equipment Size 500mm × 1000mm × 550mm (excluding PC)
    Equipment Weight 30kg
    Power AC220V (60hz)
    Current Consumption 300mA or less

    Capability to manufacture various sockets for package verification

    ITEM SPEC
    Test device BGA, WLCSP, LED, ETC
    Test pitch[mm] 0.35/0.4/0.5/0.65/0.75/0.8/1.0
    Temperature -50℃ ~ 200℃
    Life cycle > 300,000 Cycles
    Test pin POGO Pin, J contactor

    DMD Controller for Direct Image Exposer

    OUTLINE

    • Controller for DLP 9500 Chip control
    • Equipped with high-precision micro-pattern exposure algorithms
    • Capable of development and production in OEM format
    • Provides a rich software library optimized for image processing and exposure

    SPEC

    ITEM Common
    DMD Controller    		 SDM-D9500
    DMD Tilting Angle Fixed Flexible
    Exposer Resolution Fixed Flexible
    Image Processing S/W &H/W S/W
    FPGA Logic H/W Dependent H/W Independent

    FEATURE

    • Exposure method

      -Application of DMD rotation and parallel exposure algorithms

      - Various DMD tilt angles can be applied based on environment settings via software

    • Frame Per Sec

      - 1920x1080 HD Binary Image at 16,000 FPS

      - 1024x768 XGA Binary Image at 22,000 FPS

    • Brightness control

      - Light intensity control via software

    • Image Format

      - DXF File

      - Gerber File

    • Main Feature

      - No need for high-speed communication processing, reducing the controller size and hardware cost

      - Adoption of an open hardware architecture, enabling the application of various applications

    • Power

      - DC 12V, 8A

    DMD Controller for Direct Image Exposer

    OUTLINE

    • DMD Controller for compact 3D scanners
    • Custom-made to optimize for the customer's system, with a provided software library
    • Produced and supplied in OEM format
    • Designed with only firmware and FPGA, ensuring hardware stability without using an OS kernel

    FEATURE

    • Resolution

      - 608 x 684

    • Frame Per Sec

      - 360, 720, 960, 1440Hz (Max.4000Hz) @1bit

    • Number of patterns

      - 20 Pattens

    • Image Format

      - bitmap format

    • Interface

      - UART

    • Electrical Characteristics

      - Power Supply : DC 5V, 2A

      - Operating Temperature : -20°C ~ 85°C

      - Storage Temperature : -40°C ~ 85°C

      - RGB LED Current : Min 300mA, Max 1.5A